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UDV-80J東洋pvc切割保護(hù)膜,晶圓切割uv膜廠家,新友維半導(dǎo)

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產(chǎn)品價(jià)格: 電詢/人民幣 
最后更新: 2013-06-01 12:06:25
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    產(chǎn)品詳細(xì)說(shuō)明

    晶圓切割膠帶 - Pressure Sensitive Series -

    晶圓切割膠帶
    Part Number :
    F - 90
    T - 80
    T - 120
    GE - 200

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form. 

    We Toyo Adtec consider needs of each user and choose appropriate tapes.

    Feature

    ● Various product line
    ● standard type (AD series)
    ● high-performance to difficult-to-adhere workpiece (GD series)
    ● excellent stability against elapsed deterioration (T series)
    ● high-performance to laser-dicing (F-90)
    ● Easy pick-up with excellent expandability

    Specification
    Recommended Works Part Number Base
    Film
    Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
    Si
    GaAs
    Other Semiconductor
    F-90MW PO MW 90 10 1 1 PVC-free type
    T-80MW PVC 80 0.8 0.7 Excellent temporal stability
    T-80HW 1.7 1
    T-120HW 120 1.7 1
    Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

    *The above data is just for representing value, and not guaranteed value.
    *Static type is lined up.
    *Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
    *Separator thickness is not included.


    晶圓切割膠帶 - UV Series -

    晶圓切割膠帶
    Part Number :
    UDV - 80J / UDV - 100J / UHP - 110B
    UHP - 0805MC / UHP - 1005M3
    UHP - 110M3 / UHP - 1025M3
    UHP - 1510M3 / UHP - 1525M3
    USP - 1515M4 / USP - 1515MG
    UDT - 1025MC / UDT - 1325D
    UDT - 1915MC

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on. 

    Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.  Elegrip dicing tapes can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form. 

    We Toyo Adtec consider needs of each user and choose appropriate tapes.


    Feature

    ● Excellent control to back-side chipping and chip fly-off.
    ● Excellent adhesiveness.
    ● Smooth peeling by UV.
    ● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

    Recommended
    Work I
    Si
    GaAs
    Other Semi conductor
    Part Number

    UDV-
    80J

    UDV-
    100J

    UHP-
    110B

    UHP-
    0805MC

    UHP-
    1005M3

    UHP-
    110M3

    基材 PVC PO
    顏色 T MW
    總厚度 (μm)

    80

    100

    110

    85

    105

    110

    黏著力 (μm) 10 5 10
    Adhesive Strength (N/20mm)

    3.8(0.2)

    3.8(0.2)

    2.9(0.2)

    5.0(0.2)

    5.0(0.2)

    7.6(0.2)

    Probe Tack (N/20mm2)

    2.1(0.05)

    2.1(0.05)

    2.7(0.05)

    1.7(0.05)

    2.7(0.05)

    3.9(0.05)

    特性 Easy pickup For less chipping For small size chips
    Recommended
    Work II
    Package
    Part Number

    UHP-1025M3

    UHP-1510M3

    UHP-1525M3

    USP-1515M4

    USP-1515MG

    基材 PO
    顏色 MW
    總厚度 (μm)

    125

    160

    175

    165

    黏著力 (μm)

    25

    10

    25

    15
    Adhesive Strength (N/20mm)

    12.0(0.2)

    6.5(0.2)

    13.5(0.2)

    14.5(0.2)

    15.0(0.2)

    Probe Tack (N/20mm2)

    5.5(0.05)

    4.2(0.05)

    5.6(0.05)

    6.2(0.05)

    5.9(0.05)

    特性 For encapsulated workpiece
    For less backside burrs
    For less glue scratch-up on the chip side walls
    For less against residue onto a making area
    Recommended
    Work III
    Glass
    Crystal
    Part Number

    UDT-1025MC

    UDT-1325D

    UDT-1915MC

    基材 PET
    顏色 T
    總厚度 (μm)

    125

    155

    203

    黏著力 (μm) 25 15
    Adhesive Strength (N/20mm)

    30.0(0.2)

    20.4(0.2)

    20.3(0.2)

    Probe Tack (N/20mm2)

    7.5(0.05)

    6.7(0.05)

    5.9(0.05)

    特性
    • For less backside cracking
    • For encapsulated workpiece
    • For less backside cracking

    *( ) is adhesive strength after UV.
    *The above data is just for representing value, and not guaranteed value.
    *Static type is lined up.
    *Color : MW (Milky White), T (Transparent)
    *UV irradiate condition : Light volume=above 150mJ/cm2.
    *UV irradiate condition may change with dicing products.
    *Separator thickness is not included.
     

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